Mobile Handset PA Performance: ET vs. APT & GaAs HBT vs. SOI/CMOS

Share

Both Silicon and GaAs PAs have been battling to gain market share for the Mobile Phone handset business. New technology such as Envelope Tracking has helped to improve silicon PA performance. This presentation will explain how to fundamentally compare the performance of linear and envelope tracking PAs and their performance in GaAs or Si technologies. Conclusions will be made regarding the best technology now and into the future for the Mobile Phone PA market.



  Date and Time

  Location

  Contact

  Registration



  • 5110 North River Blvd.
  • Cedar Rapids, Iowa
  • United States 52411
  • Building: Skyworks Soultions, Inc

Staticmap?size=250x200&sensor=false&zoom=14&markers=42.0295579%2c 91
  • Co-sponsored by Skyworks
  • Starts 07 September 2015 12:05 PM
  • Ends 15 October 2015 07:00 PM
  • All times are US/Central
  • No Admission Charge
  • Register


  Speakers

James Young

James Young

Biography:

James P. Young is vice president of advanced development at Skyworks Solutions, Inc. where he is responsible for mobile handset power amplifier and front end module design. His expertise includes power amplifier and RFIC circuit and system design in CMOS, SOI, BiCMOS, bipolar, and GaAs technologies. James holds 18 patents, has authored or co-authored over 22 papers, and taught several short courses mainly on RFIC design. He holds a bachelor’s of science in electrical engineering from Rose-Hulman Institute of Technology in Terra Haute, Indiana.

 

James Young

Biography:





Networking and refreshments 5:15 PM to 6:00 PM.  Program at 6:00 PM