Power distribution network design for high-speed printed circuit boards

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IEEE Southeastern Michigan: Chapter VIII (EMC)


Southeastern Michigan IEEE EMC Chapter technical meeting.

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  Date and Time

  Location

  Contact

  Registration


  • 19000 Hubbard Drive
  • Dearborn, Michigan
  • United States 48126
  • Building: University of Michigan - Dearborn Fairlane Center South
  • Room Number: Dining Room D
  • Click here for Map

Staticmap?size=250x200&sensor=false&zoom=14&markers=42.3252375%2c 83
  • Registration closed


  Speakers

Jun Fan

Jun Fan of Missouri S&T EMC Laboratory

Topic:

Power distribution network design for high-speed printed circuit boards

Abstract

Power Distribution Network (PDN) plays a critical role in modern multilayer printed circuit board (PCB) designs. This talk will focus on effective PDN engineering practices to ensure power/signal integrity and control EMI on PCBs. Topics include fundamental design guidelines, developing realistic target impedance, decoupling capacitor layout and placement, power-supply induced jitter, etc. Understanding the parasitic inductance is vital to the overall optimization of the PDN performance.

Biography:

Biography

Jun Fan (S’97-M’00-SM’06) received his B.S. and M.S. degrees in Electrical Engineering from Tsinghua University, Beijing, China, in 1994 and 1997, respectively. He received his Ph.D. degree in Electrical Engineering from the University of Missouri-Rolla in 2000. From 2000 to 2007, he worked for NCR Corporation, San Diego, CA, as a Consultant Engineer. In July 2007, he joined the Missouri University of Science and Technology (formerly University of Missouri-Rolla), and is currently an Associate Professor and Director of the Missouri S&T EMC Laboratory. Dr. Fan also serves as the Director of the National Science Foundation (NSF) Industry/University Cooperative Research Center (I/UCRC) for Electromagnetic Compatibility and Senior Investigator of Missouri S&T Material Research Center. His research interests include signal integrity and EMI designs in high-speed digital systems, dc power-bus modeling, intra-system EMI and RF interference, PCB noise reduction, differential signaling, and cable/connector designs. Dr. Fan served as the Chair of the IEEE EMC Society TC-9 Computational Electromagnetics Committee from 2006 to 2008, and was a Distinguished Lecturer of the IEEE EMC Society in 2007 and 2008. He currently serves as the Chair of the Technical Advisory Committee of the IEEE EMC Society, and is an associate editor for the IEEE Transactions on Electromagnetic Compatibility and EMC Magazine. Dr. Fan received an IEEE EMC Society Technical Achievement Award in August 2009.

Email:

Address:Rolla, Missouri, United States

Jun Fan of Missouri S&T EMC Laboratory

Topic:

Power distribution network design for high-speed printed circuit boards

Biography:

Email:

Address:Rolla, Missouri, United States





Chapter website: http://www.emcsociety.org

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