Organic Antenna-in-Package Designs for Millimeter Wave Applications

Share

There is an increasing demand for low-cost millimeter-wave (mmWave) systems that operate in the 60, 94 GHz, and recently 28 GHz bands for Gbps data rate communication and imaging applications. Typical applications in the 60 GHz band demanding Gbps data rates include wireless gigabit Ethernet and wireless uncompressed high-definition video. Large available spectrums, short wavelengths, and the ability to operate in dusty and foggy conditions have made mmWave frequencies at 94 GHz attractive for high-resolution imaging applications. Significant momentum has started to build around the 5G wireless communication technologies. It is expected that 5G mobile communication systems will become commercially available sometime around 2020. The objectives for developing 5G cellular networks include higher capacity, higher data rate, lower end-to-end latency, massive device connectivity, reduced cost and consistent Quality of Experience provisioning. For 5G radio access infrastructure such as base stations, one of the key enabling technologies is mmWave beam-forming. 28 GHz band is one of the candidate bands for 5G applications. Many of these mmWave systems require phased arrays. Recent advances in silicon technologies have enabled single chip solutions, making these technologies more commercially attractive. However, for the mmWave market to flourish, not only are low-cost devices solutions required, but also low-cost antenna and packaging solutions. The short wavelength at mmWave frequencies allows antennas to be embedded within a package or integrated on a chip. Antenna-in-package solutions have been recognized to have advantages over antenna-on-chip solutions in bandwidth, radiation efficiency, and low cost due to RFIC die area usage and design flexibility. The realization of robust, efficient and broadband mmWave antennas within a multilayer organic (MLO) package is challenging due to assembly difficulties, material selection, and manufacturing tolerances. This presentation will discuss these challenges and some solutions based on our group’s past 15 years mmWave research works.



  Date and Time

  Location

  Contact

  Registration



  • 802 South Halsted
  • Chicago, Illinois
  • United States
  • Building: Lecture Center F6

Staticmap?size=250x200&sensor=false&zoom=14&markers=41.8709328%2c 87
  • Co-sponsored by Department of Electrical and Computer Engineering, University of Illinois at Chicago


  Speakers

Dr. Duixian Liu

Dr. Duixian Liu

Topic:

Organic Antenna-in-Package Designs for Millimeter Wave Applications

There is an increasing demand for low-cost millimeter-wave (mmWave) systems that operate in the 60, 94 GHz, and recently 28 GHz bands for Gbps data rate communication and imaging applications. Typical applications in the 60 GHz band demanding Gbps data rates include wireless gigabit Ethernet and wireless uncompressed high-definition video. Large available spectrums, short wavelengths, and the ability to operate in dusty and foggy conditions have made mmWave frequencies at 94 GHz attractive for high-resolution imaging applications. Significant momentum has started to build around the 5G wireless communication technologies. It is expected that 5G mobile communication systems will become commercially available sometime around 2020. The objectives for developing 5G cellular networks include higher capacity, higher data rate, lower end-to-end latency, massive device connectivity, reduced cost and consistent Quality of Experience provisioning. For 5G radio access infrastructure such as base stations, one of the key enabling technologies is mmWave beam-forming. 28 GHz band is one of the candidate bands for 5G applications. Many of these mmWave systems require phased arrays. Recent advances in silicon technologies have enabled single chip solutions, making these technologies more commercially attractive. However, for the mmWave market to flourish, not only are low-cost devices solutions required, but also low-cost antenna and packaging solutions. The short wavelength at mmWave frequencies allows antennas to be embedded within a package or integrated on a chip. Antenna-in-package solutions have been recognized to have advantages over antenna-on-chip solutions in bandwidth, radiation efficiency, and low cost due to RFIC die area usage and design flexibility. The realization of robust, efficient and broadband mmWave antennas within a multilayer organic (MLO) package is challenging due to assembly difficulties, material selection, and manufacturing tolerances. This presentation will discuss these challenges and some solutions based on our group’s past 15 years mmWave research works.

Biography:

Duixian Liu received the B.S. degree in electrical engineering from XiDian University, Xi’an, China, in 1982, and the M.S. and Ph.D. degrees in electrical engineering from the Ohio State University, Columbus, in 1986 and 1990, respectively.

From 1990 to 1996, he was with Valor Enterprises Inc. Piqua, Ohio, initially as an Electrical Engineer and then as the Chief Engineer, during which time he designed an antenna product line ranging from 3 MHz to 2.4 GHz for the company, a very important factor for the prestigious Presidential “E” Award for Excellence in Exporting in 1994. Since April 1996, he has been with the IBM T. J. Watson Research Center, Yorktown Heights, NY, as a Research Staff Member. He has received three IBM’s Outstanding Technical Achievement Awards and one Corporate Award, the IBM's highest technical award. He was named Master Inventor in 2007. He was the chief editor for Advanced Millimeter-wave Technologies - Antennas, Packaging and Circuits published in 2009 by Wiley and co-editor for Handbook of Antenna Technologies published by Springer in 2016. He has authored or coauthored more than 100 journal and conference papers. He received the Best Paper Prize of the 2007 IEEE International Workshop on Antenna technology for “Antenna-in-package in LTCC for 60 GHz Radio,”  IBM Research's 2011 Pat Goldberg Memorial Best Paper Award in Computer Science, Electrical Engineering and Math for “Organic Packages with Embedded Phased-Array Antennas for 60-GHz Wireless Chipsets,” and the 2012 S. A. Schelkunoff Prize Paper Award of the IEEE Antennas and Propagation Society for “Dual Grid Array Antennas in a Thin-Profile Package for Flip-Chip Interconnection to Highly Integrated 60-GHz Radios,” He has 64 patents issued and 17 patents pending (95% initiated by him). His research interests are antenna design, EM modeling, chip packaging, digital signal processing, and communications technologies.

 

Dr. Liu is a Fellow of IEEE, and was an associate editor for the IEEE Transactions on Antennas and Propagation (2005-2013), a Guest Editor for the IEEE Transactions on Antennas & Propagation special issues on Antennas and Propagation Aspects of 60-90 GHz Wireless Communications (October 2009), Antennas and Propagation at mm- and sub mm-waves (April 2013) and Antennas and Propagation Aspects of 5G Communications (October 2017), the Lead Guest Editor for International Journal of Antennas and Propagation on special issues on Wearable and RFID Antennas (July 2013) and a section editor for a Springer antenna handbook (2015). He has been an organizer or chair for numerous international conference sessions or special sessions and served as a technical program committee member for many international conferences. He was the general chair of the 2006 IEEE International Workshop on Antenna Technology: Small Antennas and Novel Metamaterials, White Plains, New York. He has served as an external Ph.D. examiner for several universities and external examiner for government organizations on research grants.

Email:

Address:United States

Dr. Duixian Liu

Topic:

Organic Antenna-in-Package Designs for Millimeter Wave Applications

Biography:

Email:

Address:United States